描述
整个车间自动化系统为二级控制系统,即设备控制级和信息管理级,设备控制级即一级系统为RMC200轧线控制系统,采用ABBMasterPiece系统,由10套ABBMasterPiece200/1过程站、3套MasterPiece90过程站、和3台AdvantStation500系列操作站、1台VT340监控站及2台MasterAid220编程器构成。各过程站之间的网络通讯采用MasterBus300(简称MB300),通过加热炉的过程站与二级信息管理级进行通讯。每一个MP200/1过程站通过一个DSCS140通讯板连接到MB300网络上,通过MB300网络进行数据交换,通讯板上可以设定地址开关,据此来确定该节点在网络上的位置。对于MP200/1与打捆机MP90的通讯,通过RMC7系统中的通讯板DSCS131连接至MODEM,打捆机上也分别装一MODEM和通讯板DSCS131,由MODEM来实现远程通讯。在加热炉RMC1的MP200/1系统中,通过DSCS150板与二级计算机系统IBMNetifinity5000服务器通讯,二者通过GCOM网络进行数据交换。下面以RMC2为例,简介实现轧钢生产设备故障诊断的智能化。
欧美品牌停产的,常用的“PLC”备品备件
我司产品应用于以下领域:
1,《发电厂DCS监控系统》
2,《智能平钢化炉系统制造》
3,《PLC可编程输送控制系统》
4,《DCS集散控制系统》
5,《智能型消防供水控制系统》
6,《化工厂药液恒流量计算机控制系统》
7,《电气控制系统》造纸,印染生产线,变电站综合自动化控制系列
本特利,英维思,伍德沃德,福克斯波罗、西屋、瑞恩、施耐德莫迪康、ABB、AB、西门子、摩托罗拉、GE发那科、安川、博世力士乐,ACSO,力士乐等各大品牌的DCS系统配件,机器人系统配件,大型伺服系统备件。
C52781 Sloan Dektak V300-Si 12″Wafer Surface Profiler
C73574 MRSI 505 Assembly Work Cell Pick&Place System
K69474 Logitech LP50 Precision Lapping&Polish.System
C71289 Micrion 9100 Focused Ion Beam FIB Milling System
C73914 Varian Unity Inova 500 NMR Spectrometer System
C54479 Jeol JSM-IC848 Scanning Electron Microscope
C75409 Zeiss EM902A Transmission Electron Microscope
C69679 K&S 4524AD Digital Manual Ball Wire Bonder
C72437 Finnigan MAT 8230 Mass Spectrometer
A74871 Mydax 2VLH60W Water-Cooled Chiller/Heater
C68069 HP 83000 Digital Test System Model F660
G52281 Nanometrics Nanospec 9000 Film Analysis System
G40450 ADE Technologies Polar Kerr System
A69510 Logitech 1WBT2 Wafer Substrate Bonder,3 Station
G69555 Logitech 1WBS2 Wafer Substrate Bonder
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G54625 Asymtek A-612C Dispensing System
G50677 FK Delvotec 6320 Bonder System
C59111 Electroglas 2001CXE 6”Wafer Prober 2001CX 2001X
C69224 K&S 4522 Multi-Process Gold Wire Ball Bonder
A73230 Beckman P/ACE MDQ Capillary Electrophoresis Sys
C55921 YES Yield Engineering Sys YES5 Vapor Prime Oven
A73251 Kodak Image Station 4000MM Pro Imaging System
G70686 Multiline Technology Optiline Post X-Ray Machine
C59242 Electroglas 3001X 8″Wafer Prober Probe Station
C74218 PE Sciex API QStar Pulsar 1 Mass Spectrometer
A51532 Asymtek Millennium Series Dispensing System,600
C56237 Zevatech CT-3000 Pick and Place Machine
G54212 Asymtek A-618C Millennium Dispensing System
G66395 Hitachi S-2300 Scanning Electron Microscope
G54295 Asymtek Dispensing System
G75521 TA Inst.TGA2050 Thermogravimetr?ic Analyzer
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A70055 Thermo Nicolet Nexus 470 FT-IR,Centaurus Scope
A69734 LC Packings Famos,Switchos,Ultimate HPLC Sys
AE43005 Synax SX-141 Pick and Place Wafer Handler
AN43004 Alessi 6″Prober XYZ w/Microscope,Extras
A58421 Wentworth Labs 8″Prober MM2004(0-043-0001)
C69531 Rudolph AutoEL III 2B 4A Automatic Ellipsometer
C69866 K&S 4129 Vertical Feed Wedge Bonder w/Heated Tip
A73561 Cincinnati Test Systems Sentinel M24 Leak Test
C57559 Tokyo Seimitsu TSK A-WD-4000A Wafer Dicing Saw
A74058 Yamato Ohkawara DL-41 Spray Dryer
L66981 Disco Corp Automatic Dicing Saw DAD-3D/8
C71085 Gaertner Scientific Corp.L115 S Ellipsometer
C70347 Solid State Measurements CV Test Analysis System
C69865 K&S 4124 Gold Ball Wire Bonder w/LWD Microscope
C69864 K&S 4124 Gold Ball Wire Bonder w/Negative E.F.O.
C69692 K&S 4124 Thermosonic Gold Ball Wire Bonder
C28990 Orthodyne 20R Wire Bonder w/Nikon SMZ-1 Scope
C62291 Rucker&Kolls R&K 691 Automatic Wafer Prober
CT71086 Karl Suss Wafer Prober Probe Station w/Wild M3Z
K74410 GE LUNAR Prodigy 8743 Bone Densitometer Density
C59276 Orthodyne 20B Ultrasonic Large Wire Bonder
C69693 K&S 4129 Deep Access 90°Wedge Wire Bonder
C64901 K&S Kulicke Soffa 4126 Step-Back Wedge Bonder
C59003 K&S 4123 Manual Wedge Wire Bonder(Refurbished)
C58972 K&S 4123 Manual Wedge Wire Bonder(refurbished)
A73229 Beckman Coulter DU 800 UV/Vis Spectrophotomet?er
C69596 Westbond 7400A Deep Access Vertical Feed Bonder
C64574 HTG 84-3(350W)UV Lamp Mask Aligner w/Power Sup
G51906 Wentworth Labs.MP2000 8″Probe Station